Products
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Direct Bonded Copper Dbc
Posted: 02 Jun 2011 Direct bonded copper (DBC) substrates consist of a ceramic isolator, Al2O3 (aluminium oxide) or AlN (aluminium nitride), to which pure copper is applied in a high temperature melting and diffusion process. The result is a non-detachable connection of |
Direct bonded copper (DBC) substrates consist of a ceramic isolator, Al2O3 (aluminium oxide) or AlN (aluminium nitride), to which pure copper is applied in a high temperature melting and diffusion process. The result is a non-detachable connection of copper and ceramics.Due to the high heat conductivity of Al2O3 (24 W/mK) and AlN (130 to 180 W/mK) and the excellent heat capacity of the thick copper coating (200 – 600 µm) DBC substrates are ideally suited for high power electronics. The temperature coefficient of expansion (TCE) of Al2O3 and AlN closely matches that of silicon. This minimizes the mechanical stress in the bare silicon die which is attached to the substrate since the TCE of DBC Al2O3 and AlN are much closer to that of silicon than other materials.
Advantages:
Extraordinary heat dissipating capability and temperature resistance
High isolation voltage
Excellent heat spreading
Adjusted expansion coefficient enables chip on board
Efficient chip soldering and wire bonding directly on the master card
Al2O3-DBC-Substrates
Al2O3 DBC substrates is decisively determined by the heat conductivity and thickness of the used ceramics. Therefore, Al2O3 DBC substrates are offered with different ceramic features and thicknesses (0.38–1.00mm) for customer-specific applications.
Al2O3 ceramic based substrates are standard products with the best price performance ratio. They are mainly used in applications of medium and lower output areas, such as
general power electronics
concentrated photovoltaics (CPV)
Peltier elements
semiconductor modules for automotive applications
AlN-DBC-Substrates
AlN combines excellent thermal conductivity and good mechanical stability. Another advantage of AlN compared to Al2O3 is its adjusted thermal expansion coefficient, which is closer to that of silicon and thus hardly causes any thermal tension in the solder layer between the chip and the substrate.
DBC substrates based on AlN ceramics are mainly used in applications with very high o |
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| Price Range: |
0.5 -
50
USD |
| FOB/Port: |
Xiamen |
| Payment Terms: |
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| Minimum Quantity: |
5000
Pieces |
| Available Within: |
12 weeks |
| Sample Available: |
Yes
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| Member since: 04 Dec 2010 ELE Advanced Ceramics applies advanced technology to manufacture ceramics (Aluminum Oxide, Zirconia, Aluminum Nitride, Silicon Carbide and Silicon Nitride, etc.) with outstanding properties of high strength, high resilience, superb hardness, Manufacturer from Xiamen, China |
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